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课程背景：

在电子封装中 ,焊点失效将导致器件乃至整个系统失效 ,焊点失效的起因是焊点中热循环引起的裂纹及其扩展。从焊点的微观组织及其变化、焊点失效分析、焊点可靠性预测等方面介绍了对电子封装焊点及其可靠性研究的状况。

课程目标：

理解电子装联技术

 了解可靠性、质量认证及测试；

 了解塑料封装器件的潮气敏感性及相关问题

 理解电子器件静电防护和过电损伤

课程大纲

电子装联技术 Electronic manufacturing

 电子芯片晶元制造 Wafer fabrication

 电子元件封装 Electronic packaging

 电子元件电路板组装 Electronic component assembly

可靠性、质量认证及测试 Reliability、Qualification and test

 微电子器件及微系统简介Brief introduction of microelectronic devices and micro-electronic systems

 可靠性描述和浴盆曲线 Reliability description and bathtub curve

 常见可靠性模型和加速因子估算 Common reliability model and active factor estimation

 可靠性试验和认证 Typical reliability tests

 器件结构分析 Package construction analysis

塑料封装器件的潮气敏感性及相关问题 Moisture Sensitivity and Relevant Issues

 塑料封装器件中的水汽扩散、回流焊接过程中湿气蒸发引起的分层、爆裂等失效现象

Moisture diffusion in plastic packages, moisture induced failure modes such as delamination, popcorn crack, etc.

 器件湿气敏感性分级：JESD020:非气密性表面封装固态电路的水汽/回流敏感性等级

Moisture sensitivity level: JESD020: Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

 如何判断与湿气敏感性相关的失效的根本原因：器件质量还是电子组装？

How to judge the root cause when popcorn crack happens: device quality or SMT problem?

 器件怀疑吸湿如何处理：实用指南

What to do, if your devices are susceptible of excessive moisture absorption: a practical guide

电子器件静电防护和过电损伤 ESD and EOS

 静放电/电过应力基本概念介绍 ESD/EOS definition and distinguish

 器件/系统静放电评估和实验方法 Component level ESD while system level ESD evaluation and test

 静放电控制和检查 Typical ESD control and checklist in manufacture process

 电过应力预防和根因分析难点 Typical EOS prevention and challenge of root cause identification

 典型案例 Case study